Applied Materials Stock News

Lam Research, Applied Materials, and KLA are all under pressure. Citi believes there's even more downside potential after the three stocks have booked big declines as of late.

Shares of chip-equipment makers headed for historic losing streaks on Friday, dragged down by concerns about the hot pace of artificial-intelligence spending.

The S&P 500's strong overall performance reflects its heavy weighting at the top. Under the surface, more than a third of the index's stocks are down at least 20% from their 52-week highs.

SAN FRANCISCO, Oct. 13, 2026 (GLOBE NEWSWIRE) -- At its 2026 SEMICON West Investor Breakfast Presentation held today, Applied Materials, Inc. presented its longer-term growth expectations and outlined how its leadership in materials engineering positions the company to outperform the wafer fab equipment (WFE) market over the coming years.

SUNNYVALE, Calif., Oct. 12, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today unveiled its Equipment and Process Innovation and Commercialization (EPIC) Center, a $5 billion capital investment* to build the world's largest facility dedicated to collaborative semiconductor process technology and manufacturing equipment R&D...

The Santa Clara-based firm – a key supplier of equipment and software that tech giants like TSMC, Intel and Samsung use to build chips – is aiming to achieve faster breakthroughs by having scientists, engineers and researchers from companies and universities around the world collaborate under one roof.

R&D programs to focus on speeding up the commercialization pipeline so chip technology moves from breakthrough research to full-scale manufacturing faster Collaborative work at the state-of-the-art facility in Silicon Valley pairs UCLA's semiconductor research strength with Applied's cutting-edge chipmaking equipment and process integration expertise SANTA CLARA, Calif., Oct. 08, 2026 (GLOBE NE...

Collaborations at Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Oregon aim to develop breakthroughs in next-generation transistors, interconnects and advanced packaging technologies for AI chips and systems  Collaboration builds on the companies' long history of working together to solve complex semiconductor device scaling challenges SANTA CLARA, Calif., Oct. 06, 2026 (GLOB...