TOKYO--(BUSINESS WIRE)-- #renesas--Renesas today announced the SLG46801, the industry's smallest GreenPAK configurable mixed-signal device offered in both WLCSP and STQFN packages.
TOKYO--(BUSINESS WIRE)-- #IoT--Renesas expanded its RZ/G Series with new 64-bit general-purpose microprocessors (MPUs) for Human Machine Interface (HMI) and IoT edge systems.
TOKYO--(BUSINESS WIRE)--Renesas will gradually scale down and end manufacturing operations at the Takasaki Factory over the next 2 to 3 years while maintaining R&D functions.
TOKYO--(BUSINESS WIRE)-- #InvestorRelations--Renesas announced consolidated financial results in accordance with IFRS for the three and six months ended June 30, 2026.
TOKYO--(BUSINESS WIRE)-- #InvestorRelations--Renesas today announced the consolidated financial forecasts for the nine months ending September 30, 2026.
TOKYO--(BUSINESS WIRE)-- #AI--Renesas announced Gen 3 DDR5 MRDIMM chipset solutions, delivering DDR5 server-class MRDIMM speeds up to 16,000 mega transfers per second (MT/s).
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