€32.80
0.58% today
L&S, Jun 27, 03:24 pm CET
ISIN
JP3375800004
Symbol
6967
Sector
Industry

Shinko Electric Industries Share price

JPY5,645.00
+56.00 1.00% 1M
+181.00 3.31% 6M
+161.00 2.94% YTD
+91.00 1.64% 1Y
+1,605.00 39.73% 3Y
+4,730.70 517.41% 5Y
+4,741.84 525.03% 10Y
Tokyo, Closing price Thu, Jun 27 2024
ISIN
JP3375800004
Symbol
6967
Sector
Industry

Key figures

Market capitalization JPY764.77b
Enterprise Value JPY711.96b
PER (TTM) P/E ratio 41.10
EV/FCF (TTM) EV/FCF negative
EV/Sales (TTM) EV/Sales 3.39
P/S ratio (TTM) P/S ratio 3.64
P/B ratio (TTM) P/B ratio 2.89
Dividend yield 0.88%
Last dividend (FY23) JPY50.00
Sales growth (TTM) Sales growth -26.68%
Turnover (TTM) Turnover JPY209.97b
EBIT (operating result TTM) EBIT JPY24.81b
Free cash flow (TTM) Free cash flow JPY-26.46b
Cash position JPY82.81b
EPS (TTM) EPS JPY137.73
P/E ratio expected 25.77
P/S ratio expected 3.04
EV/Sales expected 2.83
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Shinko Electric Industries Share analysis

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Analyst opinions

7 Analysts have issued a Shinko Electric Industries forecast:

1x Buy
14%
5x Hold
71%
1x Sell
14%

Analyst opinions

7 Analysts have issued a Shinko Electric Industries forecast:

Buy
14%
Hold
71%
Sell
14%

Financial data from Shinko Electric Industries

Profit and loss account P&L | Balance sheet | Cash flow


Quarter TTM Annually
Mar '24
+/-
%
209,972 209,972
27% 27%
100%
- Direct costs 171,070 171,070
12% 12%
81%
38,902 38,902
58% 58%
19%
- Selling and administrative expenses - -
- Research and development costs 3,496 3,496
2% 2%
2%
52,450 52,450
53% 53%
25%
- Depreciation and amortization 27,639 27,639
20% 20%
13%
EBIT (operating result) EBIT 24,811 24,811
68% 68%
12%
Net profit 18,609 18,609
66% 66%
9%

Figures in millions JPY.

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Company profile

Shinko Electric Industries Co., Ltd. engages in the manufacture and sale of semiconductor packages. It operates through the following business segments: Plastic Package, Metal Package, and Others. The Plastic Package segment manufactures plastic laminated packages (PLP) and integrated circuit assemblies. The Metal Package segment produces semiconductor lead frames, glass-to-metal seals, heat spreader, ceramic electro static chucks, and precision contact parts. The Others segment deals with the operation of its subsidiaries. The company was founded on September 12, 1946 and is headquartered in Nagano, Japan.

Head office Japan
Founded 1946
Website www.shinko.co.jp

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