ASE Technology Stock News

TAIPEI , Aug. 11, 2025 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces its revised unaudited consolidated net revenues for July 2025.

ASE Technology Holding Co., Ltd. (NYSE:ASX ) Q2 2025 Earnings Conference Call July 31, 2025 3:00 AM ET Company Participants Joseph Tung - Group Chief Financial Officer Kenneth Hsiang - Head of Investor Relations & VP Tien Yu Wu - Group COO & Representative Director Conference Call Participants Brad Lin - BofA Securities, Research Division Charlie Chan - Morgan Stanley, Research Division Chia Yi...

TAIPEI , July 31, 2025 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (TWSE: 3711, NYSE: ASX) ("We", "ASEH", or the "Company"), the leading provider of semiconductor assembly and testing services ("ATM") and the provider of electronic manufacturing services ("EMS"), today reported its unaudited[1] net revenues of NT$150,750 million for 2Q25, up by 7.5% year-over-year and up by 1.8% sequentially.

TAIPEI , July 10, 2025 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces its revised unaudited consolidated net revenues for June and 2nd quarter of 2025.

Relationship Broadens Scope to Key ASE and SPIL Facilities with Multi-Phase Deployment Milestone Positions ASEH and Ainos as First-Mover in AI-Powered Scent Intelligence for the Semiconductor Industry SAN DIEGO, CALIFORNIA / ACCESS Newswire / June 27, 2025 / Ainos, Inc. (NASDAQ:AIMD)(NASDAQ:AIMDW) ("Ainos" or the "Company") , a leader in AI-driven scent digitization, today announced the expansi...

TAIPEI , June 10, 2025 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces its revised unaudited consolidated net revenues for May 2025.

As the benefits of Moore's law reach their limits, advances in chip performance turn to the back end of production. Back-end semiconductor processing is booming due to limits in front-end innovation. Advanced packaging, like TSMC's 2.5D CoWoS, is crucial for AI chip performance as Moore's Law slows. There is a significant packaging bottleneck for AI chips, with Nvidia consuming most of TSMC's C...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge) with Through Silicon Via (TSV), propelling technology enablement for artificial intelligence (AI) and its pervasive impact on global life. Delivering critical performance improve...