CORNING, N.Y.--(BUSINESS WIRE)--Corning Incorporated's (NYSE: GLW) Board of Directors declared a quarterly dividend on October 6, 2026 of $0.28 per share. The dividend will be payable on December 11, 2026, to shareholders of record on November 13, 2026. Caution Concerning Forward-Looking Statements The statements contained in this release and related comments by management that are not historic...
Software stocks came roaring back in the third quarter as fears that AI would disrupt traditional business models faded, with Salesforce, Microsoft, Workday and Veeva among the biggest winners. CNBC's Jim Cramer sees more upside for software leaders including Salesforce and Microsoft, while warning that higher interest rates are the biggest risk heading into the new quarter.
Corning Inc (NYSE:GLW, XETRA:GLW) will supply the fiber and cable AT&T needs to expand its network under a multi-year agreement valued at more than $3 billion, the companies said on Tuesday. The news sent Corning shares up almost 4%, while AT&T Inc (NYSE:T, XETRA:SOBA) shares were down around 0.6%.
AT&T signed a $3 billion deal with Corning, which will supply the mobile carrier with the fiber and cable needed to expand its network and meet growing demand for data.
AT&T on Tuesday said it had signed a multi-year deal worth more than $3 billion with Corning to procure fiber and cable, as the telecom giant expands its network to meet surging demand for data.
DALLAS and CORNING, N.Y., Sept. 29, 2026 /PRNewswire/ -- The more than $3 billion agreement solidifies AT&T's commitment to bring the best and fastest connection to more Americans as internet use and AI continue to drive demand Key Takeaways: AT&T and Corning entered into a multi-year agreement to supply the fiber and cable AT&T needs to bring fast, reliable internet to more Americans as deman...
MALAGA, Spain--(BUSINESS WIRE)--Lumentum Holdings Inc. (“Lumentum”) today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026. The board-level demonstration will combine a D2D interface IP subsystem from Qualcomm Technol...
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